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PCB LAYOUT |
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PCB製作 |
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PCB組裝焊接 |
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PCB相關業務諮詢 |
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| 使用機台 |
SAMSUNG CP45 | ||||||||
Stencil Size Range (鋼板尺寸) |
550 mm * 650mm | ||||||||
Min. IC Pitch (IC最小腳距) |
0.20 mm | ||||||||
Max. PCB Size(PCB最大尺寸) |
450 mm* 420 mm | ||||||||
Min. PCB Thickness (PCB最小厚度) |
0.35 mm | ||||||||
Min. Chip Size (最小尺寸) |
0201 | ||||||||
Max. BGA Size (BGA尺寸) |
45 mm * 45mm | ||||||||
BGA Ball Pitch |
0.2.mm | ||||||||
BGA Ball Diameter |
0.2 mm | ||||||||
QFP Lead Pitch |
0.2 mm | ||||||||
上件誤差 |
0.05 mm | ||||||||
Frequency of Stencil Cleaning |
1 times / 5 - 10 Pieces (0201) | ||||||||
